• 6^th Workshop on Photonic Integrated Circuits at OFC
• Wednesday March 6^th, 2019 from 5:45pm to 8:30pm (with registration opening at 5:15pm)
• Room 29ABCD at the San Diego Convention Center

The advent of 100Gbps and beyond in both longhaul as well as datacom marked the breakthrough of photonic integration in a broader sense. As a result of this, PICs are now also being used e.g. in sensing, life sciences, and military applications and there is thus a growing group of people that are starting to design and use photonic chips.

However, the PIC value chain can be complex as one needs to make choices for the material system, the foundry and/or broker, the design and layout software, packaging solutions and so on. The aim of the PIC workshop is to bring together all the relevant players independent of material system and to provide an in-depth overview that allows you to make the right trade offs and to get to know the key PIC service providers. There will be a particular focus on multi-project wafer (MPW) shuttles together with the accompanying Process Design Kits (PDKs), since these substantially lower the cost of developing a PIC, provide a complete solution, create first-time right, and reduce the PIC development time.

The PIC workshop starts with a detailed overview of everything that you need to know in order to design, fab, and package a photonic chip. Subsequently there is a networking break during which you can interact with the key PIC service providers, who have table tops and provide useful information. During the break, food will be served and there will be drinks. After the break, there are several use case presentations by companies that are using photonic ICs and that are sharing their experiences.

OFC 2019 marks the 6^th PIC workshop at OFC. Each year, we tried to improve the format and content of the workshop. Partly as a result, the OFC PIC Workshop attracted well over 350 attendees during the last few years. Starting in 2018, the group of supporting companies has widened by including more vendors of design and software solution as well as now also including providers of test & measurement equipment. This year, the use case section will focus on key trends and questions in photonic integration and there will be a dynamic panel discussion.

For any questions about the PIC workshop, please contact Erik Pennings at erik@7pennies.com or (848) 228-0807.

The PIC Workshop will be held on Wednesday March 6, 2019 from 5:15pm to 8:30pm, i.e. right after the conference and exhibition end for that day. The workshop takes place as part of the OFC conference and is held in Room 29ABCD of the San Diego Convention Center.

5:15 PM – 5:45 PM: Buffet Opens, Sponsor Tabletops and Networking

5:45 PM – 7:00 PM: Keynote Presentation “Key Trends and How to Use the PIC Ecosystem to Best Develop a PIC”

• Welcome, Introduction, and Key Market Trends: Erik Pennings, GM & Principal, 7 Pennies Consulting
• InP-Based Integrated Photonics: Richard Visser, Chief Commercial Officer, Smart Photonics
• – on behalf of Smart Photonics and HHI
• Silicon Photonics: Bertrand Szelag, Head of Silicon Photonics, CEA-LETI
• Dielectrics Based Photonic Integration: Arne Leinse, Chief Commercial Officer, Lionix International
• – on behalf of Lionix and Ligentec
• Regrowth-Free Fabless InP PICs: Valery Tolstikhin, Founder, President & CEO, Intengent
• Design Simulation, and Layout Tools: Twan Korthorst, Director Photonic Solutions, Synopsys
• – on behalf of Synopsys, Lumerical, Luceda Photonics, Photon Design, VPI Photonics, and Dassault Systemes SIMULIA
• Packaging: Isabel de Sousa, Business Development Manager, IBM Canada
• – on behalf of IBM, Chiral Photonics, Avo Photonics, and ficonTEC
• Test and Measurement: Hansjoerg Haisch, Program Manager, Keysight Technologies
• – on behalf of Keysight Technologies, EXFO, and Tektronix
• PIC Design Houses: Inigo Artundo, CEO, VLC Photonics

7:00 PM – 7:40 PM: Networking Break with Buffet and Sponsor Tabletops

7:40 PM – 8:10 PM: Use Cases and Key Topics in Photonics Integration

• “O, C and L Band Silicon Photonics PDKs at AIM Photonics”
• – by Erman Timurdogan, Director of PDK Development, Analog Photonics
• “Silicon Photonics: From high volume transceivers to optical I/O”
• – by Robert Blum, Director of Strategic Marketing and Business Development, Intel
• “Overcoming the Challenge of Combining Lasers with Silicon Photonics”
• – by John Bowers, Director Institute for Energy Efficiency and Professor, UC Santa Barbara
• “Compact Silicon Photonics-Based Multi Laser Module for Sensing”
• – by Simon Ayotte, Team Leader, Integrated Photonics at TeraXion (Canada)
• “Photonic Wirebonding and 3D Nanoprinting for Optical Packaging and Assembly”
• – by Christian Koos, Co-founder and Chief Technology officer (CTO), Vanguard Photonics

8:10 PM – 8:30 PM: Panel discussion

• Question & answer on key PIC topics with panel consisting of all speakers and/or panelists from sponsoring companies

The workshop is supported by a wide group of service providers to the PIC industry. It includes foundries for pretty much all the relevant material systems, providers of simulation and layout software, packaging houses, test and measurement, as well as providers of turn-key PIC design solutions. The common denominator for most companies is that they support multi-project wafer (MPW) runs and process design kits (PDK), which are a great and cost-effective way to develop PICs.

Keysight Technologies Inc. is the world’s leading electronic measurement company, transforming today’s measurement experience through innovations in wireless, modular, and software solutions. With its HP and Agilent legacy, Keysight delivers solutions in wireless communications, aerospace and defense and semiconductor markets with world-class platforms, software and consistent measurement science. The company’s nearly 10,500 employees serve customers in more than 100 countries. (Keysight Technologies)

LioniX International B.V. is a leading global provider of customized microsystem solutions, in particular integrated photonics-based, in scalable production volumes. We provide customized solutions for OEM’s and System Integrators, from design to device, by vertical integration in scalable production volumes and maintaining technology leadership secured by strong IP position. As LioniX International we focus on Photonic Integrated Circuits (PIC) enabled modules based on our proprietary waveguide technology (TriPleX™), in addition to our other core competences micro-fluidics, opto-fluidics and MEMS. As vertically integrated company  we deliver a complete solution to our OEM customers: from initial design through volume manufacturing of products. (www.lionix-int.com)

ficonTEC is an innovative high-tech company that has rapidly established itself in a highly-specialized market. With continued growth and innovative development since 2001, we are the recognized market leader when it comes to automated assembly and testing of micro-optics and opto-electronics components. The core team at ficonTEC consists primarily of development engineers from the specialist fields of optics and photonics, from electrical, mechanical and mechatronic engineering, as well as from software development. These developers are supported by experienced technicians possessing a wide variety of skills. Our technical competence, worldwide contacts and – importantly – the will to understand our customer’s needs and to find individual and optimum solutions, together make us a competent business and development partner. 
(www.ficontec.com/)

Chiral Photonics (CPI), a New Jersey, US based company founded in 1999, specializes in optoelectronic packaging of integrated photonics.  CPI offers its pitch reducing optical fiber arrays, PROFAs, which enable the highest density optical I/Os for both edge and face coupling to photonic ICs. Currently, up to 61 I/O channels can be coupled in a single port.  Other services range from single-die optical coupling or optoelectronic package development, including test services, to volume optoelectronic production packaging.Please contact us to obtain our free coupling and packaging design guidelines: designguide@chiralphotonics.com.

EXFO is a manufacturer of laboratory type fiber optic test instrumentation, not limited to, but primarily used in telecom type applications. Applications range from PIC design, research and development to manufacturing and production. EXFO’s product portfolio consists of high dynamic range tunable laser sources, automated wavelength dependent passive optical component testers, optical spectrum analyzers, tunable filters, and multipurpose modular test platform OSICS with modules ranging from tunable laser sources to switches, attenuators, DFB sources and more. 
(https://www.exfo.com)

Regrowth-Free Taper-Assistant Vertical Integration (TAVI) Platform for Fabless PICs in InP
The regrowth-free taper-assisted vertical integration (TAVI) is a monolithic photonic integration technology in InP, intended for providing the end users with an access to state-of-the-art PICs under the fabless model. A Consortium of Global Communication Semiconductors, LLC (GCS) – a wafer fabrication foundry, Intengent, Inc., – a technology provider, and VLC Photonics S.L. – a design house, was set up in 2017 as a vehicle for delivering the turnkey custom solutions to fabless InP PICs, based on the TAVI platform.
Global Communication Semiconductors, LLC (GCS), Torrance, CA, USA – a leading InP wafer fabrication foundry with a great deal of the TAVI PIC experience, which owns the related process and delivers it on 4” wafers (6” wafers are coming).
Intengent, Inc., Ottawa, ON, Canada – a prominent InP PIC expert and technology provider, having an extensive background in the TAVI platform and customized PIC development / productizing based on it.
VLC Photonics S.L., Valencia, Spain – a reputable pure-play PIC design house with a track of records in the circuit integration, layout design, and custom PDK development for fabless InP PICs.

Innovations for the digital society of the future are the focus of research and development work at the Fraunhofer Heinrich Hertz Institute HHI. In this area, Fraunhofer HHI is a world leader in the development of mobile and optical communication networks and systems, fiber optical sensor systems as well as the processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions. The institute develops standards for information and communication technologies and creates new applications as an industry partner. (www.hhi.fraunhofer.de)

Synopsys is driving the photonic integrated circuit (PIC) revolution with design automation solutions for a wide range of application requirements, from data communications to sensors and biomedical devices. Synopsys’ PIC Design Suite – including the RSoft™ OptSim™ Circuit and PhoeniX OptoDesigner tools – offers a seamless PIC design flow from concept to manufacturable design, as well as access to a single, world-class support channel. The PIC Design Suite’s design, simulation, and mask layout implementation capabilities for PICs provide a modular and synergistic integration towards first-time-right fabrication. RSoft OptSim Circuit supports the design and optimization of PIC functionality. PhoeniX OptoDesigner has photonic-aware physical layout capabilities to synthesize PIC layouts for fabrication. The PIC Design Suite enables both PDK-driven and custom design, and supports the widest portfolio of foundries offering MPW access. The PIC Design Suite integrates with the RSoft Photonic Component Design Suite, Synopsys HSPICE®, and Sentaurus™ TCAD tools for cohesive, precise simulations of photonic and optoelectronic components and provides cosimulation of electronic and photonic circuits. Learn more at www.synopsys.com/optical-solutions.html.

IBM Assembly and Test is a world leader in semiconductor packaging technology and services based in North America. We offer 45 years of advanced packaging, assembly and test experience, a system level mindset and skilled engineers who understand requirements from development to volume manufacturing. Originally an IDM we now offer full OEM services to our customers. In the recent years we have developped and offered next generation photonic solutions and heterogeneous integration, Our work in areas such as silicon photonics is unrivaled for high volume manufacturing applications but we also offer build to print solutions. IBM will help you deliver differentiated solutions while providing personalized, expert support to meet even the toughest application goals. (www.ibm.com)

LIGENTEC is offering wafer scale fabrication of silicon nitride photonic integrated circuits (PIC) for applications in telecom/datacom, quantum optics, optical (bio-)sensing. The propriatory low loss waveguide technology together with the low bending losses that thick film nitride enables paves the way to new integrated applications. Thick silicon nitride chips can thus scale down to four times in cost compared to thin film silicon nitride. The combination of cost scaling and low loss is resulting in more cost-effective solutions. (https://www.ligentec.com)

CEA (Commissariat à l’Energie Atomique et aux Energies Alternatives) is a French Governmental Research Organization (15,000 employees). Within the “CEA-TECH” branch devoted to industrial Research & Development, CEA-LETI is one of the major European research centers in applied electronics, optics and sensing. It is located in Grenoble-France where it operates 11,000 m²-State-of-the-Art CMOS clean rooms (200 and 300 mm wafer size), and a MEMS microsystems platform (200 mm wafer size). Nearly 1,600 men and women are serving innovation and the transfer of technology in key domains. Besides, CEA-LETI has sparked the creation of thirty high-technology start-ups, including Soitec, world leader in the development/ production of Silicon on insulator wafers.

As a pioneer in Research & Development in Silicon Photonics (since 2002), CEA-LETI has developed strong expertise and know how in the design, fabrication and test of integrated devices (including Ge-on-Silicon photodetectors and hybrid III/V-on-Silicon lasers) and circuits for telecom and datacom applications. ST microelectronics is one of its main industrial partner in the field. (http://www.cea.fr/english/Pages/cea/the-cea-a-key-player-in-technological-research.aspx)

VPIphotonics sets the industry standard for end-to-end photonic design automation comprising design, analysis and optimization of components, systems and networks. We provide professional simulation software supporting requirements of integrated photonics, optoelectronics and fiber optics applications, optical transmission system and network applications, as well as cost-optimized equipment configuration. Our team of experts delivers professional consulting services addressing customer-specific modeling and design requirements. VPIphotonics’ award-winning off-the-shelf and customized solutions are used extensively at hundreds of corporations worldwide; over 160 academic institutions joined our University Program. For further information, please visit us at www.VPIphotonics.com.

As electronics become smaller and more capable, they become more complex. Necessary innovation must be met with ever-advancing technical capability. Tektronix designs and manufactures the test, measurement and monitoring solutions that break through the walls of complexity, to accelerate global innovation. Tektronix solutions have supported many of humankind’s greatest advances of the past 65 years. Health. Communication. Mobility. Space. We are committed to the scientists, engineers and technicians around the world who will define the future, and rely on us to embrace the technological challenge, as partners in their innovation (www.tek.com).

SMART Photonics, located in Eindhoven, The Netherlands, is a Pure Play Foundry offering III-V production services for both discrete- as well as integrated- Indium Phosphide based photonic components. We use our knowledge, experience and the dedicated equipment to create and produce the photonic designs of our customers. We offer the complete production process from Epitaxial growth, processing, re-growth and polishing of wafers up to dicing and coating of the sides of the chips. Next to the production support, in either the proof of concept (POC) phase or the full production phase, we also offer single- or combined- process steps to complete, or back-up, the production processes of our customers. (www.smartphotonics.nl)

Avo Photonics is the photonics industry’s trusted source for exclusive, private label photonics design, development, and manufacturing. We produce confidential, client-owned optoelectronic solutions and products for medical, military, industrial, aerospace and communications applications. Since 2003, we’ve earned the trust and confidence of these key markets for three important reasons:

• Optical, mechanical, thermal and electrical engineering are in our DNA. We were founded and are still guided by laser physicists and engineers who blend these critical, photonics-based disciplines into a single source for the conceptualizing, design, testing and producing of precision, rugged, optoelectronic components and assemblies.
• When we say confidential and client-owned, we really mean it. We work with market leaders that demand strict confidentiality and advanced technology that address their rapidly evolving photonics needs. When clients engage us, we become an extension of their organization. The knowledge and any patent-eligible intellectual assets we create become the sole property of our clients.
• Our AvoLight™ Services and our processes enable us to work with companies at nearly any stage of their product lifecycle. We become vested partners in their projects, delivering on-time and on-budget solutions regardless of their complexity, size or shape.

Avo is a U.S.-based company. Our Philadelphia, Pennsylvania facility houses our corporate headquarters, engineering, testing and manufacturing in a 41,000 square-foot building that features 22,000 square-feet of variable clean space for manufacturing. Design verification and prototyping are also supported at our Toronto, Ontario, facility. (http://avophotonics.com/)

VLC Photonics aims to be a complete but flexible partner in photonic integration, thanks to its deep expertise in the whole integration process, from the preliminary feasibility studies, to fabrication platform selection, optical chip design, foundry and packager brokerage, and chip characterization and test. VLC Photonics has been working for more than 14 years in the field, with experience in all major international fabs (+15) in all main material substrates (silicon photonics, InP, GaAs, PLC, SiN, TriPleX, etc.). Our know-how includes multiple passive and active components like AWGs, MMIs, Echelle gratings, modulators, lasers, switches, filters, etc. Our field of expertise is mostly in optical telecommunications, datacom and optical interconnects, microwave photonics, quantum optics, and sensing systems like fiber sensor interrogators or biophotonics lab-on-a-chip. (http://vlcphotonics.com)

Photon Design was started in 1992 in Oxford UK to provide professional quality software to the photonics industry. Since that time it has introduced many innovations to photonics modelling, and now provides World-leading tools for the modelling of active and passive photonics components and circuits. Photon Design products are now in use in 30+ countries, 100s of research labs and contributed to 1000s of leading research publications, helping to develop the next generation of datacom components and innovations in micro and nano-optics. We are also able to provide custom solutions based on our standard products and our experts with decades of simulation experience are available for consulting. (https://www.photond.com)

Lumerical – Since its inception in 2003, Lumerical has pioneered breakthrough simulation technologies that help bring new product concepts to life. Lumerical’s software tools support a broad range of photonic and electromagnetic design and analysis applications. From component level analysis using optical and electrical solvers to photonic integrated circuit and system design and simulation, Lumerical’s products are capable of addressing the most challenging design problems. Lumerical’s photonic design tools are licensed in nearly 50 countries, by more than 800 of the world’s most innovative organizations including 7 of the top 10 companies in the S&P 1200 Global IT Index and 44 of the top 50 research universities according to the Times Higher Education rankings. (www.lumerical.com)

Luceda Photonics wants photonic IC engineers to enjoy the same first-time-right design experience as electronic IC designers. Luceda Photonics’ tools and services are rooted in over 50 years of experience in photonic integrated circuit (PIC) design. Photonic Integrated Circuit (PIC) designers need full control of their design framework to make sure that what they fabricate matches exactly how they designed it. In addition they need to be able to re-use and distribute their design work in a hierarchical framework that saves time and improves reliability. IPKISS.flow is a scripting environment that covers the complete photonic IC design flow up to measurement feedback for true component validation. What you layout is what you calculate. IPKISS.eda inside L-Edit combines these stringent photonic design demands with the ease of use of a professional yet easy to use EDA environment. (http://www.lucedaphotonics.com/en)

Dassault Systemes, the 3DEXPERIENCE® company, provides business and people with virtual universes to imagine sustainable innovations. Powered by the 3DEXPERIENCE® Platform, SIMULIA delivers realistic simulation applications that enable users to explore real-world behavior of product, nature and life. Dassault Systemes SIMULIA develops and markets high performance 3D simulation software for mechanical, electromagnetic, photonic, and multi-physics applications. (https://www.cst.com) (https://www.cst.com)

OSA Industry Development Associates (OIDA) Membership–Delivering Business Value through Best-In-Class Member Benefits and Exceptional Advocacy. OIDA membership provides an immediate return on investment through: powerful advocacy to policymakers and other stakeholders, business and networking opportunities, Industry intelligence and benchmarking and discounts on promotional opportunities and events. (http://www.osa.org)

Please find below here the bios, pictures and logos for the key note speakers, the use case speakers, as well as the panel participants. Please note that we’re in the process of confirming additional speakers and will update the list shortly.

Hansjoerg Haisch is program manager for Network & Data Center Solutions within the Internet Infrastructure segment of Keysight Technologies’ Communications Solutions Group. Prior to his current postion, Hansjoerg was responsible for the definition and development of test & measurement products, solutions for photonic component and transmission test as well as digital coherent transmission. He joined Agilent Technologies in 2001 as an R&D project manager.

In 1990, Hansjoerg started his career as an R&D engineer for opto-electronic components in the Alcatel Research Center in Germany, where he was responsible for the design and characterization of opto-electronic components. Later, he managed projects for high speed transmission, CaTV and fixed wireless networks in Alcatel research and product divisions. Hansjoerg holds a Ph.D. form Stuttgart University and a Master of Science from Oregon State University both in Electrical Engineering. (www.keysight.com)

Alexander Janta-Polczynski has a B.Eng. degree in Engineering Physics from Ecole Polytechnique de Montreal where he received a mention of excellence. In his degree he specialized in numerical simulations for solid state physics and laser matter interactions. Optics has been a central field of work for Alexander from his first internships in the dot com era to designing AWG for DWDM. In his master’s degree in computer simulation and imaging, he created a real-time STM image predictor to understand the complex convolution of electronic states in tunneling current measurements. He then worked in speech recognition with the Hidden Markov Model and Neural Networks algorithms. He joined IBM in 2007 and is presently a Professional Engineer for IBM Bromont (Quebec, Canada) at the C2MI research center. His work focusses on advanced semiconductor packaging and manufacturing. He joined the IBM Silicon Nanophotonics Team in 2012 to help with the optical characterization and packaging challenges. Alexander is co-author on several papers and inventor on 11 patents.

Pavel Zivny is a high speed serial data Domain Expert with the wide band oscilloscopes group of Tektronix. Pavel has a number of oscilloscope related patents, papers and articles, and represents Tektronix and T&M on industry panels and program committees, e.g. IEEE 802.3cd Ethernet. His current interests in the high speed serial data field include Equivalent Time Sampling and Real-Time oscilloscope measurements as well as signal generation with BERTs and Pattern Generators.

Ignazio Piacentini has a B.Sc. in Nuclear Engineering (Milan, Italy, 1975) and a M.Sc. degree in Digital Systems and Instrumentation (Polytechnic of Central London, UK, 1987). Before joining the machine vision industry in the early ‘90’s, he has spent many years working for the European Commission (Euratom) designing control and data acquisition systems for large-scale thermonuclear fusion experimental projects, including a long spell at the JET Joint Undertaking (Culham Labs, UK). Before relocating to Germany, he directed ImagingLab Srl, in Lodi, Italy, an engineering/consulting company specialized in machine vision and advanced robotics. He also held the position of Business Development Manager Europe for imaging and motion of National Instruments Austin, TX/USA from 1999 to 2003. During this time, he also served two 3-year mandates as a member of the Board of Directors of EMVA (European Machine Vision Association).

Patrick Runge received the Dipl.-Ing. degree in computer science and the Ph.D. degree in electrical engineering from the Technical University of Berlin, Germany, in 2005 and 2010, respectively. From 2005 to 2007, he was with the Hymite GmbH, where he was involved in the RF design and measurement of optoelectronic packages for optical communication. In 2007, he returned to the Technische Universität Berlin to pursue the Ph.D. degree, where he investigated nonlinear effects and applications of ultralong semiconductor optical amplifiers. After finishing his Ph.D. degree, he worked from 2010 to 2011 for a patent attorney. Since 2011, he is with the Fraunhofer Heinrich Hertz Institute (HHI) where he is engaged in the development and fabrication of photodetectors based on InP. Currently, he is the head of the Detector Group within the Photonic Components Department at HHI. He is a member of the ECIO steering committee and a member of the CSW/IPRM subcommittee. (www.hhi.fraunhofer.de)

Dr. Simon Ayotte works as Team Leader – Integrated Photonics at TeraXion (Canada). Dr. Ayotte is expert in advanced laser systems for various applications. He has been acting as Technical Leader for all development phases of a Multi-frequency Laser Source (MFLS) program, including the current integrated SiP-MFLS development effort.  Dr. Ayotte also supervised the design, manufacture and delivery of several high-end instruments to various customers, including 13 laser phase locking systems developed for the Atacama Large Millimeter Array (ALMA) radio telescope. Before joining TeraXion in January 2008, Dr. Ayotte worked in the Silicon Photonics group of Intel Corporation (Santa Clara, CA, 2006-2007). He received the B.Eng., M.Sc. and Ph.D. degrees in electrical engineering from Université Laval (Canada).

Michael Geiselmann studied physics and engineering at University Stuttgart and Ecole Centrale Paris. After his PhD at the Institute of Photonic Sciences (ICFO) in Barcelona in 2014 he joined the laboratory of photonics and quantum measurements at EPFL. In 2016, he co-founded LIGENTEC. At LIGENTEC he is advancing the technology development of silicon nitride based integrated circuits and is looking for new business opportunities. He is responsible for technical sales and brought LIGENTEC to several European and transatlantic projects and customers.

Christian Koos is full professor at Karlsruhe Institute of Technology (KIT) and co-founder of Vanguard Photonics GmbH and Vanguard Automation GmbH, where he is currently engaged as chief technology officer (CTO). His research interests comprise silicon photonics and hybrid integration concepts along with the associated applications in high-speed communications, optical sensing and metrology, as well as ultra-fast photonic-electronic signal processing. A special focus of his activities has been on the concept photonic wire bonding and on additive nanofabrication of micro-optical elements in photonic integrated circuits. Christian Koos received the PhD (Dr.-Ing.) degree in Electrical Engineering from the University of Karlsruhe in 2007. From 2008 to 2010, he was affiliated with the Corporate Research and Technology department of Carl Zeiss AG, where he led the technology forecast in the area of nanotechnology. He has received several research awards and prestigious grants such as a Starting Independent Researcher Grant by the European Research Council (ERC Starting Grant) in 2011 and an ERC Consolidator Grant in 2017. He has published more than 110 journal papers and filed more than 30 patent applications.

John Bowers is Director of the Institute for Energy Efficiency and a professor in the Departments of Electrical and Computer Engineering and Materials at the University of California, Santa Barbara. His research interests are primarily concerned with silicon photonics, optoelectronic devices, optical switching and transparent optical networks and quantum dot lasers. Bowers received the M.S. and Ph.D. degrees from Stanford University. He worked for AT&T Bell Laboratories and Honeywell before joining UCSB. Bowers is a fellow of the IEEE, OSA and the American Physical Society, and a recipient of the IEEE Photonics Award, OSA/IEEE Tyndall Award, the IEEE LEOS William Streifer Award and the South Coast Business and Technology Entrepreneur of the Year Award. He is a member of the National Academy of Engineering and the National Academy of Inventors.

Twan Korthorst is Director of Photonic Solutions for Synopsys. He has been active in the field of chip design and fabrication for non-traditional semiconductor micro and nano technologies for almost 25 years. He joined the PhoeniX Software team in 2007 and developed the company into a leading supplier of design solutions for photonic ICs in his role as CEO. In February 2018, Synopsys acquired PhoeniX Software, bringing together all the required software tools for PIC design and manufacture within one single organization and one single support channel. He will continue to lead the team in Enschede (The Netherlands) and advocate for photonic integration technologies around the world. (www.synopsys.com)

Valery Tolstikhin is the founder, President and CEO of Intengent, Inc. an Ottawa, Canada based consultancy and fabless development service provider in the area of III-V photonics. He was previously the founder and CTO of OneChip Photonics, co-founder and CEO of ArtIC Photonics, and co-founder and CTO of Electro-Photonic-IC (ELPHiC) – all fabless developers of photonic integrated circuits (PICs) in indium phosphide (InP), based in Ottawa. By using regrowth-free taper-assisted vertical integration (TAVI) platform in InP and leveraging III-V monolithic microwave integrated circuit (MMIC) infrastructure, Intengent, in a partnership with the key industry players, delivers InP PIC design to manufacture for tele- / datacom markets and beyond. Tolstikhin has been working on the regrowth-free InP PIC technologies and the fabless models they enable for since 2000. He received Ph.D. degree in radio physics from Moscow Institute of Physics and Technology (MIPT) in 1980 and D.Sc. degree in semiconductor physics from Kotel’nikov Institute of Radioengineering and Electronics (IRE) in 1993. (www.intengent.com)

Dan Neugroschl received the M.S. degree in materials science from Columbia University, New York, NY, USA. He is currently the President of Chiral Photonics., Pine Brook, NJ, USA, which he cofounded in 1999.

Jeffrey Perkins, PhD, is the COO for Avo Photonics. With broad experience in high-volume optical component production, he joined Avo Photonics from JDSU where he served as Director of Manufacturing Engineering, Technical Manager of Process Development and Automation, and Senior Technical Manager of Product Development. Prior starting in the optoelectronics industry in 1999, Dr. Perkins held technical positions in microelectronics packaging for IBM in Endicott, New York. Jeff holds a PhD in Mechanical Engineering from Lehigh University in Bethlehem, Pennsylvania.

Dr Bertrand Szelag received the Master degree in Physics from the University of Lille in 1994 and the PhD degree in Microelectronics from the University of Grenoble in 1999. He has been a visiting researcher in Tohoku University in 1997 working in the field of sub-100nm CMOS transistor properties. In 1999 he joint STMicroelectronics in Crolles, France to work on BiCMOS platfrom development for Analog/RF applications. Since 2013, he has been with the LETI, MINATEC Institute, Grenoble, France as a Project Manager and senior process integration researcher in the field of silicon photonic devices. His current research activities included high speed silicon modulator, germanium photodetectors and hybrid III-V laser integration in silicon. He is the author or co-author of more than 50 papers in scientific journals and international conference proceedings in the field of CMOS, Bipolar and DMOS transistors and silicon photonic devices.

Erman Timurdogan is currently the Director of PDK development at Analog Photonics (AP). He is defining the roadmap and leading the model, design, and characterization of AP-SUNY SiPh process design kits (PDKs) at American Institute for Manufacturing Integrated Photonics (AIM Photonics). Prior to that, He directed the development of active photonic components. His focus is on high speed, low power SiPh optical transceiver systems. Before joining AP, he received his Ph. D. in electrical engineering and computer science in 2016 from the Massachusetts Institute of Technology (MIT). At MIT, he demonstrated ultra-low power SiPh modulators, 3D integrated electronic-photonic transceivers on 300mm silicon-on-insulator wafers. He taped out over 20 silicon photonic full reticle passive and active runs. He authored a book chapter, >70 peer-reviewed conference, journal publications and issued patents which were cited over 1400 times. He has 3 publications in Nature Publishing Group. (www.analogphotonics.com)

Arne Leinse Ph.D (Chief Commercial Officer) is active in integrated optics for more than 15 years. He received a PhD degree from the University of Twente in the integrated Optical Microsystems group in 2005. Hereafter he joined LioniX BV where he was involved in the invention and development of the TriPleX™ platform from the beginning. He has been involved from the original concept until the exploitation and (co)authored over 100 articles in the last years. He has been active as Vice-President of LioniX BV in the last years and since the establishment of LioniX-international in 2016 active in the role of Chief Commercial Officer. (lionix-international.com)

Inigo Artundo (CEO): Obtained the M.Sc. in Telecom Engineering at the Universidad Publica de Navarra (Pamplona, Spain) in 2005, and received his Ph.D. in Applied Physics and Photonics at the Vrije Universiteit Brussel (Brussels, Belgium) in 2009. He has been involved in several national and European research projects and networks of excellence focused on reconfigurable optical interconnects, the design, fabrication and characterization of micro-optic devices, and on flexible access and in-building fiber network architectures. He has worked as a reviewer for several scientific journals and national funding agencies. He holds specializations in Business Financing, Commercial Management and Research, and Strategic Marketing. He is a member of IEEE, SPIE and COIT. (www.vlcphotonics.com)

Isabel de Sousa has an Engineering degree in Physics and M.Sc.A in metallurgy / materials from Ecole Polytechnique of Montreal. She has worked under diverse positions at IBM Canada, starting as a failure mode analyst, then turning to manufacturing engineering for bond and assembly processes and has been at the forefront of the Pb-free transition acquiring deep insight in all aspects of assembly technology. In recent years, her focus has turned to market analysis and new business development for IBM Canada with emphasis on optical assembly and silicon photonic opportunities. (www.ibm.com)

Dr. James Pond is the CTO and co-founder of Lumerical Inc. and is a driving force behind the company’s core software algorithms, technology, and advanced photonic modeling capabilities. He has almost two decades of experience in optical and photonic simulation, and is the author of numerous papers, patents and conference presentations.

Torsten Vahrenkamp holds a Diploma for Applied Laser Technologies from the University of Applied Sciences in Emden, Germany in 1998. During further work at the Institute of Laser Technology in Emden and University of Loughborough, UK, he built a fully automatic laser lithography system for rapid generation of microstructures in submicron dimensions. He also developed a process to generate the world’s first in-glass diffractive optics using ion exchange processes in gradient refractive index glass, and which is still used today for the generation of waveguides in glass. Torsten is Chief Executive Officer of ficonTEC Service and one of the co-founders of the company. When founding the company in 2001, the goal was to provide automatic and semi-automatic assembly and test solutions for the photonics industry.

Dominic Gallagher was born in Swansea, UK in 1962. He received a BA and PhD from the University of Cambridge in 1984 and 1987 respectively, and afterwards as a Research Fellow studying optical logic elements in laser diode-based devices. Afterwards he spent two years at the Fraunhofer IAF in Germany, working on high speed laser diodes and grating devices. In 1992 he returned to the UK to found Photon Design. He is currently CEO of Photon Design – a company developing photonicssoftware which is used in over 30 countries around the World. He has published 30+ journal articles and authored chapters in several photonics books.

François Couny is Product Line Manager for EXFO Optics Test & Measurement instruments. He started his career in 2001 as a Test & Measurement engineer at Blaze Photonics, a start-up company specialized in Photonic Crystal Fibre and completed his Ph.D. in Photonics in 2008 at the Centre for Photonics and Photonic Material at the University of Bath (UK). He went on to join Yenista Optics in 2010 with a focus on developing tuneable laser sources and spectral solutions, including an Optical Spectrum Analyzer and also an optical component tester adapted to photonic integrated circuits characterization. Since 2015, François has been PLM for Yenista Optics, now part of EXFO as EXFO Optics. (www.exfo.com)

Frank Scharf obtained his Ph.D. in Electrical Engineering from Ruhr-Universitaet Bochum, Germany. During his graduate studies, he focused on modeling and simulating the plasma sheath in high intensity discharge lamps. Frank joined CST Germany in 2008 and transferred to CST of America in 2009. He currently works as Technical Sales Director for Dassault Systemes SIMULIA with a technical focus on optical applications. (www.3ds.com/products-services/simulia/)

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